| 发明名称 |
DETECTION DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a detection device that has good economical efficiency and also has high bonding yield while lowering a defective pixel rate, and a manufacturing method thereof. <P>SOLUTION: The manufacturing method of the detection device includes the steps of: providing bumps 9b and 92b for bonding on at least one of a light receiving element array 50 and a multiplexer 70 of a readout circuit; fixing a bump height adjusting member 21 for adjusting a bump height to the light receiving element array and/or the readout circuit provided with the bumps; and pressing a flat plate 41 from tips of the bumps to deform the bumps until the flat plate abuts against the tip of the bump height adjusting member. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| 申请公布号 |
JP2010157667(A) |
申请公布日期 |
2010.07.15 |
| 申请号 |
JP20090000378 |
申请日期 |
2009.01.05 |
| 申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
NAGAI YOICHI;INADA HIROSHI |
| 分类号 |
H01L27/146;H01L21/60;H01L25/065;H01L25/07;H01L25/18;H01L27/14;H01L31/02;H04N5/33;H04N5/335;H04N5/369;H04N5/374 |
主分类号 |
H01L27/146 |
| 代理机构 |
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