| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device wherein an adhered tape hardly causes trouble in a subsequent process while resin leakage in a sealing process is suitably prevented by a heat-resistance adhesive tape. <P>SOLUTION: This method of manufacturing the semiconductor device includes at least: a mounting step of bonding a semiconductor chip 15 onto a die pad 11c of a metallic lead frame 10 with the heat-resistant adhesive tape 20 stuck on an outer pad side; a sealing step of sealing one side of a semiconductor chip side by a sealing resin 17; and a split process of splitting a sealed structure 21 into individual semiconductor devices 21a. The heat-resistant adhesive tape 20 is formed with at least a base material layer and an adhesive layer containing a mold release agent. <P>COPYRIGHT: (C)2010,JPO&INPIT |
