| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a system for electrooptically detecting a manufacture defect existing randomly in a patterned structure of a semiconductor wafer characterized by an integrated circuit die or a chip. SOLUTION: A visual field of an electrooptical camera system having a microscope lens is irradiated with short optical pulses of a pulse type laser, and a wafer that is moving onto a focus surface assembly for optically forming the surface of a photodetector, is imaged on a focus surface of an optical imaging system formed by six detector aggregates including an array of each four two-dimensional CCD matrix photodetectors. Each of the two-dimensional CCD matrix photodetectors creates a matrix electron image of two million pixels. Images created simultaneously by different CCD matrix detectors are processed in parallel by an image processing technique. The imaging visual field is compared with another one used as a reference. A difference in a corresponding pixel is detected as one showing the presence of a wafer die defect. COPYRIGHT: (C)2010,JPO&INPIT
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