| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a partition component is united with a memory device, and a lamination related to a previously formed cell or an additional memory layer lamination to an upper portion of the previously formed cell and its programming are simplified. SOLUTION: A selectively conductive organic semiconductor (e.g., polymer) device available as a memory cell is provided. A polymer solution including a conductive electrode (22) self-assembles for a conductive electrode (26). This self-assembly processing is so performed as to form the shortest conductive path. On the method, the condensed solution of the conductive polymer (23) is deposited on the conductive surface (26), and the conductive polymer (22) is self-assembled to the organic semiconductor by providing the heat and vacuum optionally. The organic semiconductor forms a structure having two or more electrodes and may be used in a single or multi-cell memory device using the organic semiconductor along a passive device between the electrodes. COPYRIGHT: (C)2010,JPO&INPIT
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