| 摘要 |
PROBLEM TO BE SOLVED: To provide a room temperature-curable organopolysiloxane composition which cures with moisture, bonds satisfactorily to a variety of base materials, and is capable of suppressing the corrosion on the electrodes and circuit boards which are exposed to corrosive substances. SOLUTION: This room temperature-curable organopolysiloxane composition includes at least (A) a diorganopolysiloxane having a viscosity at 25°C of 100-1,000,000 mPa s and having the alkoxysilyl groups or hydroxyl groups of at least 50 mol% among the groups bonding to a silicon atom at the molecular chain end, (B) an alkoxysilane or a partial hydrolyzate condensate thereof, (C) an imidazole-containing alkoxysilane or a partial hydrolyzate condensate thereof and (D) a catalyst for use in condensation reaction. COPYRIGHT: (C)2010,JPO&INPIT
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