METHOD OF MANUFACTURING BONDED SUBSTRATE, DEVICE FOR BONDING SUBSTRATE, AND DEVICE AND METHOD FOR MANUFACTURING POLYIMIDE RESIN LAYER FOR BONDING SUBSTRATE

摘要

<P>PROBLEM TO BE SOLVED: To provide a technique for jointing various substrates together by using a polyimide resin with a specific treatment applied thereto. Ž<P>SOLUTION: This method of manufacturing a bonded substrate includes: a process of forming a polyimide precursor layer on a first substrate 12; a process of flattening the polyimide precursor layer; a process of sandwiching a polyimide resin layer 17 between a second substrate 14 and the first substrate 12 after a first heating process of forming the polyimide resin layer 17 by heating the polyimide precursor layer at 200-350°C in an environment having oxygen concentration ≤50 ppm; and a second heating process of heating the first substrate and the second substrate at a temperature equal to the highest temperature of the first heating process or a temperature lower than the highest temperature of the first heating process at which the difference from the highest temperature of the first heating process is within 50°C while pressing the first and second substrates at 16.3-49 MPa. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž