发明名称 METHOD FOR SEASONING PLASMA PROCESSING APPARATUS, AND METHOD FOR DETERMINING END POINT OF SEASONING
摘要 The invention provides a method for determining an end point of seasoning of a plasma processing apparatus capable of reducing the time required for seasoning after performing wet cleaning and determining the optimum end point of seasoning with superior repeatability. The present method comprises, after performing wet cleaning (S501) of the plasma processing apparatus, using a processing gas containing SF6 as processing gas and applying an RF bias double that of mass production conditions to perform seasoning (S502), acquiring emission data of SiF and Ar during plasma processing using test conditions using SiF and Ar gases (S503), determining whether the computed value of emission intensities during seasoning is equal to or smaller than the computed value of emission intensities during stable mass production (S504), and determining the endpoint of the seasoning process when the value is determined to be equal or smaller.
申请公布号 US2010178415(A1) 申请公布日期 2010.07.15
申请号 US20090396699 申请日期 2009.03.03
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 NISHIMORI YASUHIRO;UCHIDA HIROSHIGE;SAKAGUCHI MASAMICHI;HIROTA KOUSA
分类号 B05D1/00 主分类号 B05D1/00
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