METHOD FOR MANUFATURING CIRCUIT SUBSTRATE AND FOR LAMINATING THE SUCH, AND APPARATUS FOR MANUFATURING THE SUCH

摘要

PURPOSE: A method and an apparatus for manufacturing a circuit board, and a method for laminating the circuit board are provided to prevent the oxidation of the circuit board by implementing a plasma pre-treatment process and a lamination process in a plurality of vacuum chamber. CONSTITUTION: A metal foil(202) is laminated on a base film(201). A plasma pre-treatment process is implemented with respect to the surface of the metal foil. A solid photo-resistor film(203) is laminated on the surface of the metal foil. The photo-resistor film is exposed and developed to form a pattern hole(204) which is the same shape as a circuit pattern layer. A plating layer(205) is plated through the pattern hole. Remained photo-resistor film is delaminated. The metal foil is etched to form the circuit pattern layer.