| 摘要 |
<p>PURPOSE: A semiconductor chip including densely arranged bumps and a method for manufacturing the same are provided to minimize the size of the semiconductor chip by miniaturizing the pitches of bumps. CONSTITUTION: A semiconductor chip(100) includes metal pads(110) and a plurality of bumps(120). The metal pads are arranged along the peripheral of the semiconductor chip. The metal pads are electrically connected by metal wirings, contact holes or via holes. The bumps, which are electrically connected with the metal pads, are upwardly protruded. The bumps are composed of a first part(121) and a second part(122) with different widths.</p> |
