| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device that controls deflection of temperature distribution on the surface of a carrier near a semiconductor laser. SOLUTION: The semiconductor laser device includes the semiconductor laser (130), the carrier (120) which has the carrier side surface extending to face the longitudinal direction of the semiconductor laser and a carrier edge region extending in parallel with the carrier side surface while having a predetermined width therefrom, and has a first bonding region (150) closest to one end of the semiconductor laser and a second bonding region (152) closest to the other end of the semiconductor laser in the carrier edge region, a first heat conductive part (160) having a first thermal resistance and connected between the first bonding region and an external connection terminal, and a second conductive part (162) having a second thermal resistance lower than the first thermal resistance and connected between the second bonding region and the external connection terminal, wherein the semiconductor laser is arranged on the carrier so that the one end side is closer to the carrier side surface as compared with the other end side. COPYRIGHT: (C)2010,JPO&INPIT |
