| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a multilayer wiring substrate capable of producing, by a simple method, a multilayer wiring substrate having interlayer connection achieved through a via and having minute wiring. SOLUTION: This method for producing the multilayer wiring substrate includes processes of: (A) forming an insulating layer on a surface of a substrate having a part capable of conducting electricity on the surface; (B) partially removing the insulating layer by a laser or drill to form via holes; (C) subjecting the surface on which the via holes have been formed in the process B to a de-smearing treatment to remove residues of the insulating layer on the bottoms of the via holes; (D) forming a resin layer on the surface which has been subjected to the de-smearing treatment in the process C using a resin having a functional group forming interaction with a plating catalyst element and a polymerizable group; (E) removing the resin layer formed in the bottoms of the via holes by the process D by applying a processing solution thereto; and (F) applying a plating catalyst to the remaining parts of the resin layer and thereafter carrying out plating. COPYRIGHT: (C)2010,JPO&INPIT |
