| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure capable of improving impedance characteristics more by using a flexible substrate instead of using conventional wire bonding for a semiconductor device having a microstrip line structure. SOLUTION: In the interconnection structure of the semiconductor device having a semiconductor LSI package mounted on a motherboard substrate 7 via a solder ball 42, a package substrate 4 wired and connected to the motherboard substrate 7 has an IC 2 flip-chip connected to the flexible substrate 1, and the package substrate 4 and IC 2 are connected to each other through the flexible substrate 4. COPYRIGHT: (C)2010,JPO&INPIT |
