发明名称 POLYMER EMULSION COMPOSITION FOR DIP MOLDING AND DIP MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a polymer emulsion composition for dip molding, wherein blister is hardly generated when a film stuck to a dip mold is dried after the dip mold is dipped, and the film is easily released from the mold after drying, and a dip molded article having excellent tensile strength is obtained. Ž<P>SOLUTION: The polymer emulsion composition for dip molding consists of: an emulsion of a block copolymer (A) comprising 75-100 wt.% of an aromatic vinyl-conjugated diene block copolymer having at least two aromatic vinyl polymer blocks and 0-25 wt.% of an aromatic vinyl-conjugated diene block copolymer; and an emulsion of a polymer (B) obtained by emulsion polymerizing monomers comprising 60-100 wt.% of an aromatic vinyl monomer, 0-40 wt.% of a conjugated diene monomer and 0-20 wt.% of other monomer copolymerizable with these monomers, wherein the weight ratio of the block copolymer (A) to the polymer (B) is 99/1 to 70/30. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010155952(A) 申请公布日期 2010.07.15
申请号 JP20090000072 申请日期 2009.01.05
申请人 NIPPON ZEON CO LTD 发明人 KOBAYASHI OSAMU;HATSUKU REIKO
分类号 C08L53/02;C08L25/10 主分类号 C08L53/02
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