| 摘要 |
A cooling assembly comprises a first set of electronic components coupled with a substrate; a spray evaporative cooling cap assembly coupled with the first set of electronic components; a cold plate coupled with the substrate; a second set of electronic components thermally coupled with the cold plate; cooling fluid within the spray evaporative cooling cap assembly and the cold plate, the spray evaporative cooling cap assembly configured to direct the cooling fluid against a surface of the first set of electronic components; and a fluid conditioning unit associated with the spray evaporative cooling cap assembly. |
