| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having such a connection structure that is free from short circuit, is connectable with ease, and has high versatility. <P>SOLUTION: The semiconductor device includes a semiconductor element 3 which has first and second main surfaces, facing each other, with the first main surface provided with an element electrode 4, a semiconductor element mount which mounts the semiconductor element 3 in such a manner as the second main surface of the semiconductor element 3 abuts with it, a lead terminal 1 arranged at predetermined intervals from the semiconductor element mount, a band-like connection conductor 6 which electrically connects the element electrode to the lead terminal, and a sealing resin 7 which partially covers the semiconductor element 3, the connection conductor 6, and the lead terminal, while guides part of the lead terminal to the outside. Here, the element electrode 4 of the semiconductor element 3 mounted on the semiconductor element mount is so formed as to protrude from the surface of semiconductor element. <P>COPYRIGHT: (C)2010,JPO&INPIT |
