| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a susceptor capable of forming, on a surface of the susceptor formed of SiC, desired unevenness for suppressing adhesion of a wafer to be mounted. SOLUTION: This method for manufacturing the susceptor includes: forming a recessed pattern on a surface of a substrate to be processed; applying SiC paste containing SiC powder and a sintering agent to embed the recessed pattern; laminating a SiC substrate on the SiC paste; and firing the SiC paste to form a projecting part on the surface of the SiC substrate. COPYRIGHT: (C)2010,JPO&INPIT |
