POLISHING PADS FOR CHEMICAL MECHANICAL PLANARIZATION AND/OR OTHER POLISHING METHODS

摘要

Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material.