METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD FOR ENCAPSULATING SEMICONDUCTOR, AND SOLVENT-BORNE SEMICONDUCTOR ENCAPSULATING EPOXY RESIN COMPOSITION

摘要

Disclosed is a novel method for manufacturing a semiconductor package, which can suppress the formation of voids in an encapsulating resin. Specifically disclosed is a method for manufacturing a semiconductor package, which comprises: (1) a step wherein a first member, which is selected from a group consisting of semiconductor chips and circuit boards, is coated with a solvent-borne semiconductor encapsulating epoxy resin composition that essentially contains (A) an epoxy resin, (B) a phenolic novolac resin in such an amount that the mole number of phenolic hydroxyl groups is 0.8-1.2 times the mole number of epoxy groups in the component (A), (C) a curing accelerator and (D) a solvent; (2) a step wherein the coated composition is dried by volatilizing the solvent therefrom; and (3) a step wherein the first member and a second member, which is selected from a group consisting of semiconductor chips and circuit boards to form, together with the first member, a semiconductor chip/circuit board pair or a semiconductor chip/semiconductor chip pair, are thermally compression bonded with each other with the coated and dried composition interposed therebetween.