| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate on which an electrode of an electronic component and a connection pad can be normally connected through solder by accurately recognizing a recognition mark having a solder layer welded to the surface thereof by an image recognition device. <P>SOLUTION: In the wiring substrate having the recognition mark 7 to the surface of which the solder layer 10 is welded and which includes an intersection portion 11 and a plurality of extension portions 12 extending from the intersection portion 11, each of the extension portions 12 has an intersection connection portion 12a coming into contact with the intersection portion 11 in the same width W1 as the intersection portion 11 and a wide portion 12b disposed adjacent to the intersection connection portion 12a and having a width W2 wider than the intersection portion 12a, a maximum thickness T1 of the solder layer 10 at the intersection portion 11 and intersection connection portion 12a being less than a maximum thickness T2 of the solder layer 10 at the wide portion 12b. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
