| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin powder coating material for electronic parts which satisfies both of short-time curing and heat cycle resistance, and electronic parts having an insulating layer formed by applying and heat-curing the powder coating material. SOLUTION: The epoxy resin powder coating material for electronic parts is an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, wherein the component (B) is an acid-terminated polyester having an acid value of 40-80 mgKOH/g and a softening point of 100-130°C, the blending ratio of the component (B) is confined so that 0.7-1.2 carboxy group is contained per 1 epoxy group of the component (A), and the component (C) is contained in an amount of 35-60 pts.mass based on 100 pts.mass, in total, of the components (A), (B) and (C). The electronic parts have an insulating layer formed by applying and heat-curing the powder coating material. COPYRIGHT: (C)2010,JPO&INPIT |
