| 摘要 |
PROBLEM TO BE SOLVED: To provide a modular container which houses and carries a rectangular parallelepiped semiconductor ingot without damaging its corner or ridge. SOLUTION: The modular container includes a bottom plate buffering material which is placed on a bottom plate and includes a contact support portion that is in contact with the bottom face and side faces of a housed object to support the housed object and a clearance space formed near ridges and corners to prevent the buffering material from coming in contact with the ridges and corners where the bottom face and side faces of the housed object meet, and an upper lid buffering material which is placed between the upper part of the housed object and an upper lid and includes a contact support portion that is in contact with the bottom face and side faces of the housed object to support the housed object and a clearance space formed near ridges and corners to prevent the buffering material from coming in contact with the ridges and corners where the bottom face and side faces of the housed object meet. With both buffering materials, the housed material is kept and carried in the modular container. COPYRIGHT: (C)2010,JPO&INPIT |
