CONTINUOUS FILM VACUUM DEPOSITION METHOD AND APPARATUS

摘要

Related are a continuous film vacuum deposition method and an apparatus therefor, wherein the method comprises the following steps: the degree of vacuum in the vacuum deposition chamber is maintained by disposing at least one inlet vacuum pre-evacuating chamber at the inlet of the vacuum deposition chamber and disposing at least one outlet vacuum protection chamber at the outlet of the vacuum deposition chamber, each inlet vacuum pre-evacuating chamber, the vacuum deposition chamber and each outlet vacuum protection chamber are communicated by a slit, and also they are sealed by a valve provided in the slits, the substrate enters into each chamber through slits, the valve is opened when the substrate is passing and is closed after the substrate has passed, when the substrate is entering into the inlet vacuum pre-evacuating chamber or is leaving the outlet vacuum protection chamber, at least one inlet valve and at least one outlet valve are closed to keep the degree of vacuum in the vacuum deposition chamber constant. The transportation speed of the substrate is adjusted to shorten the distance between two adjacent substrates before arriving at the deposition device and to enlarge the distance between two adjacent substrates after the substrate left the vacuum deposition chamber, thereby realizing the continuous film deposition process and improving significantly the efficiency of utilizing raw materials.