发明名称 HIGH-STRENGTH HIGH-CONDUCTIVITY COPPER ALLOY ROLLED SHEET AND METHOD FOR PRODUCING SAME
摘要 <p>Disclosed is a low-cost high-strength high-conductivity copper alloy rolled sheet which has an alloy composition that contains 0.14-0.34 mass% of Co, 0.046-0.098 mass% of P, and 0.005-1.4 mass% of Sn with the balance made up of Cu and unavoidable impurities, while satisfying the relation between the Co content, that is expressed as [Co] (mass%), and the P content, that is expressed as [P] (mass%), of 3.0 = ([Co] - 0.007)/([P] - 0.009) = 5.9. In the high-strength high-conductivity copper alloy rolled sheet, deposits are present in the metal structure, and the deposits have a generally circular or generally elliptical shape and an average grain size of 1.5-9.0 nm. Alternatively, not less than 90% of all the deposits are fine deposits having a size of 15 nm or less, and dispersed uniformly. Due to the presence of fine deposits of Co and P, and the solid solution of Sn, the high-strength high-conductivity copper alloy rolled sheet can have improved strength, electrical conductivity and heat resistance.</p>
申请公布号 WO2010079708(A1) 申请公布日期 2010.07.15
申请号 WO2009JP71606 申请日期 2009.12.25
申请人 MITSUBISHI SHINDOH CO., LTD.;OISHI KEIICHIRO 发明人 OISHI KEIICHIRO
分类号 C22C9/06;C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22F1/00;C22F1/08;H01B1/02;H01B5/02;H01B13/00 主分类号 C22C9/06
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