摘要 |
<p>Disclosed is a low-cost high-strength high-conductivity copper alloy rolled sheet which has an alloy composition that contains 0.14-0.34 mass% of Co, 0.046-0.098 mass% of P, and 0.005-1.4 mass% of Sn with the balance made up of Cu and unavoidable impurities, while satisfying the relation between the Co content, that is expressed as [Co] (mass%), and the P content, that is expressed as [P] (mass%), of 3.0 = ([Co] - 0.007)/([P] - 0.009) = 5.9. In the high-strength high-conductivity copper alloy rolled sheet, deposits are present in the metal structure, and the deposits have a generally circular or generally elliptical shape and an average grain size of 1.5-9.0 nm. Alternatively, not less than 90% of all the deposits are fine deposits having a size of 15 nm or less, and dispersed uniformly. Due to the presence of fine deposits of Co and P, and the solid solution of Sn, the high-strength high-conductivity copper alloy rolled sheet can have improved strength, electrical conductivity and heat resistance.</p> |