发明名称 METHOD OF FORMING GROOVE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of forming a finer groove in a workpiece. <P>SOLUTION: First, a modified area 20 is formed by condensing a laser beam 13 within a workpiece 1 of a transparent material, and by formation of the modified area 20, a first crack 19a extended to an optical axis direction of the laser beam 13 is formed in a predetermined portion 18 to form a groove 2 by an internal stress generated in a portion of the modified area 20. Next, an internal surface of the formed first crack 19a is etched, and the groove 2 is formed in a portion in which the first crack 19a is formed by the etching. Therefore, width of the groove 2 formed in the workpiece 1 is equivalent to width of the first crack 19a. Consequently, the finer groove 2 is formed in the workpiece 1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010155259(A) 申请公布日期 2010.07.15
申请号 JP20080334168 申请日期 2008.12.26
申请人 SEIKO EPSON CORP 发明人 YAMAZAKI YUTAKA
分类号 B23K26/00;B23K26/06;C03C15/00 主分类号 B23K26/00
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