CURABLE RESIN COMPOSITION, PERMANENT RESIST USING THE SAME, PREPREG, METAL-CLAD LAMINATED BOARD, SEALING MATERIAL, PHOTOSENSITIVE FILM, METHOD FOR FORMING RESIST PATTERN, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition obtaining a cured material having sufficient flame retardancy without using a halogen-based flame retardant and sufficient electrolytic corrosion resistance, and to provide a permanent resist using the curable resin composition, a prepreg, a metal-clad laminated board, a sealing material, a photosensitive film, a method for forming a resist pattern, and a printed wiring board.

SOLUTION: The curable resin composition contains a resin and a trivalent phosphorus compound having an ethylenically unsaturated bond. It is preferable that the content of the trivalent phosphorus compound having an ethylenically unsaturated bond is 1-60 mass% based on the total amount of the solid content of the curable resin composition.

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