| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package structure with a protection bar which enhances reliability in electrical connection between a package and a printed circuit board (PCB). <P>SOLUTION: A semiconductor package structure 1 includes: a carrier substrate 10; an integrated circuit (IC) die 20 provided on a top surface 10a of the carrier substrate 10; a molding material 30 covering and sealing the top surface 10a and the IC die 20; a plurality of solder balls 40 provided on a bottom 10b of the carrier substrate 10; and at least one protection bar 50 provided on the bottom 10b of the carrier substrate 10. The protection bar 50 is made of thermosetting polymers. <P>COPYRIGHT: (C)2010,JPO&INPIT |
