发明名称 INSULATING SHEET, AND LAMINATED STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an insulating sheet excelling in easiness of handling in an uncured state, and giving a cured material excellent in dielectric breakdown characteristics, thermal conductivity, and heat resistance. SOLUTION: This insulating sheet contains a polymer (A) having a weight average molecular weight of not less than 10,000, an epoxy monomer (B1) or an oxetane monomer (B2) having a weight average molecular weight of not more than 600, an curing agent (C) which is a phenol resin or an acid anhydride, a water-added product of the acid anhydride or a denatured material of the acid anhydride, a filler (D), and a silane coupling agent (G) having an organic value of 20-320 and an inorganic value of not more than 50 in the organic conceptual diagram of an organic functional group in the formula (21). COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010157380(A) 申请公布日期 2010.07.15
申请号 JP20080333717 申请日期 2008.12.26
申请人 SEKISUI CHEM CO LTD 发明人 AOYAMA TAKUJI;MAENAKA HIROSHI;KUSAKA YASUNARI;NAKAJIMA DAISUKE;WATANABE TAKASHI;HIGUCHI ISAO
分类号 H01B3/30;B32B15/08;C08J5/18;C08K3/00;C08K5/1515;C08K5/1525;C08K5/1539;C08K5/5419;C08L61/06;C08L63/00;C08L101/00 主分类号 H01B3/30
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