| 摘要 |
<P>PROBLEM TO BE SOLVED: To optimize a detection condition of a void to reduce a workload related to the inspection of the void about the void inspection method of a laminated wafer, and to determine the right and wrong of the laminated wafer every occurrence factor of the void. Ž<P>SOLUTION: The inspection method of the void occurring in the lamination process of the laminated wafer which is manufactured by laminating two silicon wafers inspects the presence of the void with setting conditions for void detection by using the fact that the void occurring position differs according to the occurring cause. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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