发明名称 PATTERNING PROCESS
摘要 A pattern is formed by coating a chemically amplified positive resist composition comprising a resin comprising acid labile group-containing recurring units and a photoacid generator onto a substrate, drying to form a resist film, exposing the resist film to high-energy radiation through a phase shift mask having a lattice-like array of shifters, PEB, developing to form a positive pattern, illuminating or heating the positive pattern to eliminate acid labile groups for increasing alkaline solubility and to induce crosslinking for imparting solvent resistance, coating a reversal film, and dissolving away the positive pattern in an alkaline wet etchant to form a pattern by way of positive/negative reversal.
申请公布号 US2010178618(A1) 申请公布日期 2010.07.15
申请号 US20100686836 申请日期 2010.01.13
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 HATAKEYAMA JUN;YOSHIHARA TAKAO;KATAYAMA KAZUHIRO
分类号 G03F7/20;G03F1/32;G03F1/54;G03F1/70;G03F7/004;G03F7/039;G03F7/11;G03F7/38;G03F7/40;H01L21/027 主分类号 G03F7/20
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