STRUCTURE AND METHOD FOR IMPROVING SOLDER BUMP CONNECTION IN SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide structures with improved solder bump connections and methods of fabricating such structures.

SOLUTION: Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a via formed in a dielectric layer to expose a contact pad and a capture pad formed in the via and over the dielectric layer. The capture pad has openings over the dielectric layer to form segmented features. The solder bump is deposited on the capture pad and the openings over the dielectric layer.

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