发明名称 MULTI-DIE BUILDING BLOCK FOR STACKED-DIE PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a means for giving a multifunctional constituent element or much larger capacity in a single package. <P>SOLUTION: The multi-die building block 100 for a stacked-die package includes a flexible tape 110 having a first surface and a second surface, each surface including a plurality of electrical traces 112. A first die 104 is coupled, through a first plurality of interconnects 108, to the plurality of electrical traces of the first surface of the flexible tape. A second die 106 is coupled, through a second plurality of interconnects, to the plurality of electrical traces of the second surface of the flexible tape. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010157694(A) 申请公布日期 2010.07.15
申请号 JP20090264356 申请日期 2009.10.29
申请人 ADIMULA RAVIKUMAR;MYUN JIN IMU 发明人 ADIMULA RAVIKUMAR;MYUN JIN IMU
分类号 H01L25/065;H01L25/07;H01L25/10;H01L25/11;H01L25/18 主分类号 H01L25/065
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