Object e.g. square-shaped wafer, identifying method for tracking object in production process, involves detecting unique, characteristic, optical features of object, and storing detected features as indicator of object

摘要

The method involves detecting unique, characteristic, optical features (10) i.e. optical surface structure, of an object i.e. square-shaped wafer (1), as an image using a camera. The object is detected before or in a processing system. The detected features are stored as an indicator e.g. number, of the object in digital form in an electronic data processing unit e.g. host computer. The indicator is associated with the object by the data processing unit. The wafer has side length ranging from 100 to 160 mm and thickness ranging from 0.05 to 0.25 mm. Independent claims are also included for the following: (1) a method for tracking an object in a production process (2) a device for identifying an object.