DIE STACK OF ULTRA-HIGH BAND MEMORY

摘要

PROBLEM TO BE SOLVED: To provide a memory formed by use of a three-dimensional die stack.

SOLUTION: A system includes: a central processing unit (CPU); a plurality of vertically stacked integrated circuit chips communicating with the CPU; and a plurality of input/output (I/O) ports. Each I/O port includes: a memory device connected to at least one of the plurality of chips by substrate penetration vias; and a direct memory access (DMA) controller communicating with the CPU and the memory device, and managing transmission of data to the memory device or transmission from the memory device.

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