| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate processing device wherein the processing time is shortened and the accuracy of processing is improved, by a low-cost device constitution. <P>SOLUTION: There is provided with the substrate processing device which includes a processing head for applying a predetermined processing to optional places on the surface of the substrate, a first driving means for diving the substrate in a first direction and a second driving means for driving the processing head in a second direction orthogonal to the first direction and in which a two-dimensional processing is applied to the surface of the substrate with the processing head by combining a motion for driving the substrate into the first direction by a motion for driving the processing head in the second direction, wherein a third driving means for driving the processing head in the first direction is included, and the processing head is driven at a fixed speed in the first direction by the third driving means and the processing head is driven in the second direction by the second driving means while maintaining a state where the substrate is driven in the first direction at a fixed speed by the first driving means. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
