| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat conductive sheet which has superior heat conductivity and insulating properties and a power module which has superior heat dissipative properties. SOLUTION: The heat conductive sheet is formed by dispersing, in a thermosetting resin 2, secondary aggregated particles 3 of isotropically aggregated primary particles 4 of scaly boron nitride, and the secondary aggregated particles 3 have a porosity of≤50% and an average pore diameter of 0.05 to 3μm. The power module includes a power semiconductor element mounted on a lead frame as one heat dissipating member, a heat sink as the other heat dissipating member configured to dissipate heat generated by the power semiconductor element to the outside, and the heat conductive sheet conducting the heat generated by the semiconductor element from the one heat dissipating member to the other heat dissipating member. COPYRIGHT: (C)2010,JPO&INPIT |
