| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively and easily transport several types of silicon wafers different in level of contamination concentration, in relation to a method of transporting a silicon wafer for analysis. SOLUTION: This method of transporting a silicon wafer for analyzing contamination concentration on a surface of the silicon wafer includes: a bonding process S10 of bonding two silicon wafers in the same lot to each other by facing front surfaces thereof to each other while keeping a state intended to be analyzed; a transport process S20 of transporting the two silicon wafers in a state where they are bonded to each other by housing them in a wafer case after the bonding process S10; and a separation process S30 of separating the two silicon wafers in the state where they are bonded to each other into original single states after the transport process S20, and respectively introducing the separated silicon wafers into an analysis device. COPYRIGHT: (C)2010,JPO&INPIT
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