发明名称 Generating Cutting Forms Along Current Flow Direction In A Circuit Layout
摘要 Metal is deleted from portions of metal wires in an integrated circuit layout, based upon a width of the metal wires. Preliminary cutting forms having a length and a width are inserted with a first orientation in the portions of metal wire. It is determined if the width of each of the preliminary cutting forms is parallel to a width of the metal wire portions where the preliminary cutting forms are inserted. If the preliminary cutting forms have width parallel to the width of the metal wire portion, the preliminary cutting forms become part of a cutting form final layout. Cutting forms not having widths parallel to the width of the metal wire portions are removed. Cutting forms at different orientations are then inserted where the prior cutting forms were removed from and the process repeats until all portions of the metal wire have cutting forms inserted parallel to the current flow direction.
申请公布号 US2010179679(A1) 申请公布日期 2010.07.15
申请号 US20090352782 申请日期 2009.01.13
申请人 QUALCOMM INCORPORATED 发明人 LIAO HONGMEI
分类号 G06N5/02;G06F19/00 主分类号 G06N5/02
代理机构 代理人
主权项
地址