FLIP CHIP PACKAGE AND METHOD FOR PACKAGING THE FLIP CHIP

摘要

PURPOSE: A flip chip package and a method for packaging the same are provided to improve the mobility of electrons by forming an intermetallic compound and a diffusion layer without voids on the boundary between a metal bump and a solder bump. CONSTITUTION: A metal bump(40) is formed on one side of a semiconductor chip. A barrier layer(50) is formed on the external surface of the metal bump. The semiconductor chip includes a chip body(32), a chip pad(34), and a passivation layer(36). A substrate(10) includes a substrate main body(12) and a substrate pad(14). A solder bump(20) is formed on one side of the substrate to contact with the barrier layer.