| 摘要 |
PURPOSE: A manufacturing method for a semiconductor array package is provided to improve bonding ability of a plating layer while increasing plating cohesive power. CONSTITUTION: A manufacturing method for a semiconductor array package is comprised of the steps: A DFR(dry film photoresist)(20) is formed on the surface the penetration hole in which a reference point is formed on a base of the flat type. More than one penetration hole is formed by performing the first exposure and development process. The DFR is formed on the surface of the base of the flat type in which the penetration hole is formed. The die attach section and pattern formation sections are sectioned by the residual DFR a part is developed among the top surface of the base with the second exposure at least. |
