PRINTED CIRCUIT BOARD HAVING ELECTRO DEVICE AND MANUFACTURING METHOD THEREOF
摘要
PURPOSE: A printed circuit board embedded with an electronic device and a manufacturing method thereof are provided to improve the degree of freedom in a product by connecting a pair of electronic devices through a conductive via. CONSTITUTION: A cavity is formed on an inner layer substrate(S110). A metal layer is formed on one side of a resin layer. The resin layer is compressed on both sides of the inner layer substrate to bury the cavity(S120). A part of metal layer is removed to expose the cavity(S130). A penetration hole is formed on the buried cavity(S140). A conductive material is filled in the penetration hole(S150). The electronic device is mounted on both sides of the buried cavity to be electrically connected through a conductive material(S160).
申请公布号
KR20100081073(A)
申请公布日期
2010.07.14
申请号
KR20090000344
申请日期
2009.01.05
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, SUNG HO;SHIN, YOUNG HWAN;LEE, TAE GON;PARK, JE SANG;LIM, BYOUNG WOOK;KIM, TAE GUI