发明名称 PRINTED CIRCUIT BOARD HAVING ELECTRO DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A printed circuit board embedded with an electronic device and a manufacturing method thereof are provided to improve the degree of freedom in a product by connecting a pair of electronic devices through a conductive via. CONSTITUTION: A cavity is formed on an inner layer substrate(S110). A metal layer is formed on one side of a resin layer. The resin layer is compressed on both sides of the inner layer substrate to bury the cavity(S120). A part of metal layer is removed to expose the cavity(S130). A penetration hole is formed on the buried cavity(S140). A conductive material is filled in the penetration hole(S150). The electronic device is mounted on both sides of the buried cavity to be electrically connected through a conductive material(S160).
申请公布号 KR20100081073(A) 申请公布日期 2010.07.14
申请号 KR20090000344 申请日期 2009.01.05
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, SUNG HO;SHIN, YOUNG HWAN;LEE, TAE GON;PARK, JE SANG;LIM, BYOUNG WOOK;KIM, TAE GUI
分类号 H05K1/18;H05K3/30 主分类号 H05K1/18
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