| 摘要 |
<p>A joining method includes melting a hot melt joining material e.glead free solder provided between a board 11 and a component 15 to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state. The method may be used in reflow soldering.</p> |
