发明名称 |
DICING DIE BONDING FILM HAVING EXCELLENT BURR PROPERTY AND RELIABILITY AND SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad. |
申请公布号 |
EP2205693(A1) |
申请公布日期 |
2010.07.14 |
申请号 |
EP20080867582 |
申请日期 |
2008.10.28 |
申请人 |
LG CHEM, LTD. |
发明人 |
YOO, HYUN JEE;KIM, JANG SOON;HONG, JONG WAN;PARK, HYO SOON;KHO, DONG HAN |
分类号 |
C09J163/00;H01L21/58;H01L21/68 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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