A collection of components which can be used to construct bonded polygonal multi-level enclosed structures without fixings,申请号GB20100008789-传众专利搜索

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发明名称	A collection of components which can be used to construct bonded polygonal multi-level enclosed structures without fixings
摘要
申请公布号	GB201008789(D0)	申请公布日期	2010.07.14
申请号	GB20100008789	申请日期	2010.05.26
申请人	WHITE, IAN R	发明人
分类号		主分类号
代理机构		代理人
主权项
地址

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