Manufacturing method of a semiconductor device

摘要

A manufacturing method of a semiconductor device of this invention includes providing a semiconductor wafer (101) having a metal pad (102) on a front surface thereof, bonding the wafer (101) and a holding substrate (111) which bolsters the wafer (101) through a film (110), forming an opening (114) by etching the wafer (101) followed by forming an insulating film (115) on a side wall of the opening (114), forming a metal (117) in the opening (114) and separating the wafer (101) and the holding substrate (111).