| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a three-dimensional injection molding circuit component with which a desired circuit pattern can be accurately formed on the surface of a primary molded part, and furthermore a secondarily molded coating layer can be easily removed. SOLUTION: The method for manufacturing the three-dimensional injection molding circuit component includes steps for forming a primary molded part comprising a substrate by synthetic resin injection molding, forming a secondary molded part by performing injection molding of a resist resin all over the surface of the primary molded part other than a portion to form a circuit, and forming a conductor circuit layer in the portion to form the circuit where the resist resin is not coated by plating treatment. As the resist resin, a thermoplastic polyamide resin is used of which a softening point is from 100 to 230°C and of which fusing viscosity measured at 200°C is 300 to 80000 mPa s, and an organic solvent is used to dissolve and remove the resist resin coating layer. COPYRIGHT: (C)2005,JPO&NCIPI |
