| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which the generation of voids and the unfilled phenomenon of a resin material packed in the clearance between a semiconductor chip and a circuit board can be suppressed by improving the infiltrating property of the resin material. SOLUTION: In the method of manufacturing semiconductor device, a liquid resin 9 is packed in the clearance between the semiconductor chip 1 formed with bumps 3 and the circuit board 4 by supplying the resin 9 by means of a resin applying nozzle 8 after the chip 1 is bonded to the circuit board 4 through the bumps 3. The resin material 9 is supplied by vibrating the resin applying nozzle 8. COPYRIGHT: (C)2006,JPO&NCIPI |
