EXTRA HIGH BANDWIDTH MEMORY DIE STACK

摘要

PURPOSE: An extra high bandwidth memory die stack is provided to transmit data more quickly than data which is transmitted according to a conventional memory specification. CONSTITUTION: A memory device(200) communicates with a CPU. A DMA(Direct Memory Access) controller(300) communicates with the CPU and the memory device. The memory device comprises a plurality of IC chips and a plurality of I/O ports. The I/O port is connected to at least one among the IC chips by a through-substrate via. The DMA controller processes transmission of data outputted from the memory device.