PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent interference between circuit patterns by improving adhesion between an insulation layer and a circuit structure. CONSTITUTION: A resist layer is formed on a carrier(S120). A circuit pattern layer is formed by filling the conductive material in an opening of the resist layer(S130). A circuit structure is formed to electrically connect circuit pattern layers(S140). A resist layer is removed(S150). An insulation layer is formed on the surface of the circuit structure(S160). A conductive layer is formed on the surface of the insulation layer(S170). The carrier is removed(S180).