| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounter of high production efficiency wherein an electronic component is placed on a substrate with no damage and pressurized onto the substrate under an appropriate load. SOLUTION: An electronic component sucking nozzle 12 is provided which comprises a nozzle slider 26, a nozzle holder 28, and a buffer spring 30 which energizes the nozzle slider 26 toward a tip part 26a, for mounting the electronic component on the substrate. A pressurizing spring 32 is provided in addition to the buffer spring 30 which energizes the nozzle slider 26 toward the tip part 26a. The synthesized spring constant of the pressurizing spring 32 and the buffer spring 30 is larger in a draw-in side sliding range between the draw-in position and the prescribed intermediate siding position of the sliding range of the nozzle slider 26 than in a protrusion side sliding range between the intermediate sliding position and the protrusion position. |
