| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable a label base material and a sheet base material between which a thread is inserted to be stuck together without forming a recessed part, and make the thickness of the thread uniform while protecting an IC chip against a longitudinal pressure, and retain the strength of the base materials. <P>SOLUTION: This thread is structured of a strip-like resin 20 and a strip-like paper layer 30 bonded together through an adhesive 40 and further, the IC chip 10, capable of reading information in a non-contact state, which is mounted on the resin layer 20 by introducing the chip 10 way into a through hole 31 formed in the paper layer 30 and bonded to the resin layer 20 with the adhesive 40. In addition, through holes 21a to 21d are formed in a region, not opposed to the through hole 31, of the resin layer 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
